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Installation of Solution Set at Q-Technology

GARCHING & MUNICH, Germany -- SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of process and test solutions for the semiconductor industry and related markets, announces that Q-Technology Limited (Q Tech), manufacturer of compact camera modules for the global cell phone, notebook computer and security industry, has successfully installed a full SUSS equipment set at Q Tech鈥檚 facility in Hi-Tech Industrial Park Kunshan City, Jiangsu Province, China. The 200mm mask and bond aligner, spin and spray coaters and wafer bond systems are utilized for Q Tech鈥檚 wafer-level camera Fendi Replica Handbags manufacturing services. With this project SUSS MicroTec expands its activities as an equipment supplier supporting image sensor packaging and wafer-level camera manufacturing processes.

Wafer-level camera technology is capable of delivering significant size reduction over conventional camera modules in next-generation mobile devices like cell phones or PDAs. It is considered to be the first application to bring 3D packaging technologies into volume production. SUSS MicroTec鈥檚 equipment now in production at Q Tech provide the latest technology advancements for the most effective patterning. While its proven mask aligner technology allows for the highest alignment accuracy, SUSS wafer bonding systems offer tight temperature and force uniformity during bonding. The proprietary AltaSpray coating technology of SUSS MicroTec uses a revolutionary resist deposition method enabling conformal coating across flat and steeply replica clothing sloped surfaces while covering topography steps up to 600 microns and more.

鈥淭he market demands smaller form factor packages with enhanced reliability and lower costs鈥? said Dr Hao Zhou, CEO, Q Tech. 鈥淭o make this wafer scale process possible while achieving high yielding, we need reliable equipment that enables repeatable results. For us the leading-edge wafer-level packaging systems of SUSS MicroTec are the equipment of choice.鈥?

鈥淲e are proud to further prove our expertise in wafer-level packaging of CMOS image sensors and manufacturing solutions of wafer-level cameras鈥? said Frank Averdung, President and CEO, SUSS MicroTec. 鈥漌ith our complete solution portfolio and our expertise in micro-optics SUSS MicroTec can offer its customers a perfect partnership in this highly replica breitling competitive growth market.鈥?

About SUSS MicroTec

SUSS MicroTec (listed in Deutsche B枚rse AG鈥檚 Prime Standard) is a leading supplier of process and test solutions for markets such as 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor. High-quality solutions enable customers to increase process performance while reducing cost of ownership.

SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit

About Q-Technology

Q-Technology Co., Ltd (Q Tech) is a high-tech provider for semiconductor packaging and testing. The services of Q Tech currently cover two areas: Image Sensor single-chip pac
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